发明名称 シード層の形成方法及びシリコン含有薄膜の成膜方法
摘要 <p>Provided is a method of forming a seed layer for forming a thin film, which is capable of further improving a thickness uniformity of the thin film. The method of forming a seed layer that is a seed of the thin film on a base includes adsorbing at least silicon included in an aminosilane-based gas on the base, by using the aminosilane-based gas; and depositing at least silicon included in a higher-order silane-based gas having an order that is equal to or higher than disilane on the base, on which at least the silicon included in the aminosilane-based gas is adsorbed, by using the higher-order silane-based gas having an order that is equal to or higher than the disilane.</p>
申请公布号 JP5793398(B2) 申请公布日期 2015.10.14
申请号 JP20110237987 申请日期 2011.10.28
申请人 发明人
分类号 C23C16/24;H01L21/205 主分类号 C23C16/24
代理机构 代理人
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