| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a Cu-Fe-P-based copper alloy sheet suitable as a lead frame material for a semiconducting device, which has electric conductivity of 90% IACS or more, Vickers hardness of 100 or more after heated at 400°C for 1 hour, and excellent solder wettability. <P>SOLUTION: The copper alloy sheet has composition containing 0.05-0.15 mass% of Fe, 0.015-0.05 mass% of P, 0.01-0.2 mass% of Zn, 0.0005-0.003 mass% of Pb, and 0.0005-0.0015 mass% of Ag, with the balance comprising Cu and unavoidable impurities, wherein an average value in all crystal grains within a crystalline structure of an average orientation difference in all pixels in the crystal grains as measured by EBSD method using a scanning electron microscope with an electron backscatter diffraction pattern system is 2.5-5.0°, Brass orientation density is 8.0-20.0%, Copper orientation density is 10.0-22.0%, and an average grain size is 2.0-6.0μm. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
