| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a main body part with improved versatility and in a reduced size, by arranging a plurality of external terminals electrically connected to a semiconductor chip on an outer surface of the main body part including a semiconductor chip, and a plate-shaped insulating partition wall projecting from the outer surface between a pair of external terminals adjacent to each other. <P>SOLUTION: A main body part 5 and an insulating partition wall 71 are engaged with each other by engaging means 101. Thereby, a semiconductor device 1 is configured such that the insulating partition wall 71 is fixed to the main body part 5. In the semiconductor device 1, a cover section 72 is integrally formed on the insulating partition wall 71 so as to extend from a tip of a projection direction thereof and cover an upper part of a pair of external terminals 43. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
