发明名称 ガラスパッケージを封止する方法および装置
摘要 <p>An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates.</p>
申请公布号 JP5793302(B2) 申请公布日期 2015.10.14
申请号 JP20100527971 申请日期 2008.10.01
申请人 发明人
分类号 H05B33/04;H01L51/50;H05B33/10 主分类号 H05B33/04
代理机构 代理人
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