LED PACKAGE STRUCTURE

摘要

A light-emitting diode (LED) package structure (2) includes: an insulating substrate (20) that has a front bonding pad assembly (22); a dark-colored die-attach adhesive (26); blue and green LED chips (B, G) mounted on the front bonding pad assembly (22) via the dark-colored die-attach adhesive (26); and a dark-colored and light-transmissible encapsulant (21) that is disposed on the insulating substrate (20) and that encapsulates the blue and green LED chips (B, G). The encapsulant (21) has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light.