| 摘要 |
<p>The present invention provides an electronic component mounting device which can perform nailing treatment of a lead terminal that is inserted into a mounting type electronic component without a special machine when the electronic component is carried. When the electronic component is carried, a supporting pin (40) of a supporting device is used for supporting a circuit substrate (5) from the back surface. The supporting pin (40) is provided with a nailing guiding part (41) which is configured right below an insertion hole (5a) that causes insertion of a lead (20a) of a lead component (20). The upper part of the nailing guiding part (41) is provided with a lead guiding groove (41a) which extends along a vertical direction. The bottom surface of the lead guiding groove (41a) becomes an inclined surface which inclines relative to a horizontal surface. Therefore, when the lead (20a) of the lead component (20) is inserted into the insertion hole (5a), the lead (20a) is nailed along the inclined surface.</p> |
