发明名称 金型構造及び当該金型構造を用いた注型成形方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mold structure of a surface die in which the occurrence of scratch in the setting of a molding is suppressed, and a liquid injection molding method using the same. <P>SOLUTION: In the surface die 21 in which the previously molded molding 3 is set in the liquid injection molding of a resin layer 4 on the back surface 3b side of the molding 3, the surface die 21 has a holding surface 21a holding the surface 3a side of the molding 3 and a surface scratch suppressing member 40 suppressing the scratch caused between the surface 3a and the holding surface 21a in the setting is provided in the holding surface 21a. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5793671(B2) 申请公布日期 2015.10.14
申请号 JP20110115406 申请日期 2011.05.24
申请人 发明人
分类号 B29C39/26 主分类号 B29C39/26
代理机构 代理人
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