| 摘要 |
The present invention relates to an electrolytic plating electrode and to an electrolytic plating device including the same and, more specifically, to an electrolytic plating electrode having a non-conductive pattern formed partially on top of the surface of a conductive material and to an electrolytic plating device including the same. According to an embodiment of the present invention, a contact area between the surface of an object to be plated and the electrode can be minimized using the electrolytic plating electrode having a non-conductive pattern formed thereon. Accordingly, the generation of a metal composite having a multi-core part, which is generated by allowing multiple objects to be plated to be coated by simultaneously being in contact with a conductive region not having a non-conductive pattern formed thereon, can be inhibited. Also, according to an embodiment of the present invention, the reliability, quality, stability, etc. of the generated metal composite with a core-shell structure can be improved as the surface of an object to be plated can be coated with a different kind of metal before the generation of galvanic corrosion. Moreover, according to an embodiment of the present invention, the surface of the object to be plated can be coated with various different kinds of metals regardless of object to be plated. |
