| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a layout of wiring at the time of implementation effective by changing configuration of a semiconductor device. <P>SOLUTION: A first chip 21 is mounted on a first die pad 31, and a second chip 22 is mounted on a second die pad 32. The first die pad 31 and the second die pad 32 are divided and constituted in parallel to a first side 41 and a second side 42 of a seal 40. As a result, an output pin 51 from the first chip 21 and a control pin 52 of a driving circuit can project in opposite directions, thereby a wiring layout at the time of implementation can be set to a minimum route. <P>COPYRIGHT: (C)2012,JPO&INPIT |
