| 摘要 |
<p>Provided is a power conversion device capable of efficiently dissipating heat from a heat generating circuit component to a cooling body without interposing a housing on the heat dissipation path of the heat generation circuit component mounted on a substrate. A power conversion device (1) is provided with a module (11) in which a semiconductor switching element for power conversion is built into a case body (12) and a cooling member that is in contact with a cooling body (3) is formed on one surface of the case body (12). Moreover, the power conversion device (1) is provided with mounting substrates (22, 23), on which are mounted circuit components comprising the heat generating circuit component for driving the semiconductor switching element, and is provided with heat-transferring support members (32, 33) that support the mounting substrates (22, 23) at a prescribed distance from the module and that are in contact with the cooling body (3) so that heat generated by the mounting substrates is dissipated to the cooling body.</p> |
