发明名称 連続メッキ装置
摘要 <p>A serial plating system includes a plating tank that receives a plating solution, a plurality of workpieces that are serially transferred along a transfer path being simultaneously plated in the plating tank, a common cathode that is electrically connected to the plurality of workpieces via a plurality of transfer jigs that respectively hold the plurality of workpieces, a plurality of split anodes that are disposed in the plating tank so as to face the transfer path, and a plurality of power supplies that are respectively connected to a corresponding split anode among the plurality of split anodes and the common cathode, and independently control current supplied to the corresponding split anode among the plurality of split anodes.</p>
申请公布号 JP5795514(B2) 申请公布日期 2015.10.14
申请号 JP20110214301 申请日期 2011.09.29
申请人 发明人
分类号 C25D21/12;C25D17/10;C25D21/00;C25D21/10 主分类号 C25D21/12
代理机构 代理人
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