| 发明名称 |
Lead for connection to a semiconductor device |
| 摘要 |
There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion (22). The clip portion (22) comprises a major surface having two or more protrusions (32) extending therefrom for connection to a bond pad of the semiconductor device die. |
| 申请公布号 |
EP2930747(A1) |
申请公布日期 |
2015.10.14 |
| 申请号 |
EP20140163714 |
申请日期 |
2014.04.07 |
| 申请人 |
NXP B.V. |
发明人 |
GROENHUIS, ROELF, A., J.;BOETTCHER, TIM |
| 分类号 |
H01L23/492;H01L23/495 |
主分类号 |
H01L23/492 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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