A device can include a housing, a fan, and a heat sink. The heat sink can dissipate heat from a processor card. The device can be installed into a chassis of a computer.
申请公布号
EP2815289(A4)
申请公布日期
2015.10.14
申请号
EP20120868460
申请日期
2012.02.13
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
OWEN, RICHARD;BASSETT, JONATHAN, D.;QUIJANO, DAVID
