发明名称 |
HIGH PERFORMANCE PACKAGE ON PACKAGE |
摘要 |
<p>A microelectronic assembly can include a first package comprising a processor and a second package electrically connected to the first package. The second package can include two or more microelectronic elements each having memory storage array function and contacts at a respective element face, upper and lower opposite package faces, upper and lower terminals at the respective upper and lower package faces, and electrically conductive structure extending through the second package. At least portions of edges of respective microelectronic elements of the two or more microelectronic elements can be spaced apart from one another, so as to define a central region between the edges that does not overlie any of the element faces of the microelectronic elements of the second package. The electrically conductive structure can be aligned with the central region and can electrically connect the lower terminals with at least one of: the upper terminals or the contacts.</p> |
申请公布号 |
EP2929561(A1) |
申请公布日期 |
2015.10.14 |
申请号 |
EP20130814720 |
申请日期 |
2013.12.10 |
申请人 |
INVENSAS CORPORATION |
发明人 |
MOHAMMED, ILYAS;HABA, BELGACEM |
分类号 |
H01L25/065;H01L23/31;H01L23/538;H01L25/10;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|