发明名称 光学半導体装置用基台及びその製造方法、並びに光学半導体装置
摘要 The invention provides a base for an optical semiconductor device and a method for preparing the same; and the optical semiconductor device is stable in mechanical property, high in durability, and high in radiation property. The optical semiconductor device base is provided with a plurality of chip carrying portion for carrying the semiconductor chips and a plurality of signal connecting portions electrically connected with the carried semiconductor chips and providing electrode portions. The method comprises the following steps: a step of preparing metal frame, a plurality of chip carrying portions and signal connecting portions are formed on the metal frame, and the signal connecting portion is provided with a part with the thickness smaller than that of the plurality of chip carrying portions; a step of preparing the optical semiconductor device base, so surfaces and backsides of the chip carrying portions and at least one side of the signal connecting portions are exposed, and parts of the metal frame besides the chip carrying portions and signal connecting portions are buried by resin, and a shape of the optical semiconductor device is a plate shape.
申请公布号 JP5795251(B2) 申请公布日期 2015.10.14
申请号 JP20110273911 申请日期 2011.12.14
申请人 信越化学工業株式会社 发明人 後藤 渉;塩原 利夫;深澤 博之
分类号 H01L33/64;H01L21/56;H01L23/28;H01L23/48;H01L31/02 主分类号 H01L33/64
代理机构 代理人
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