| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for suspension with the size of a via plating part being controlled. <P>SOLUTION: The present invention solves the above problem by providing a substrate for suspension where a first wiring layer and a second wiring layer are laminated via a first insulating layer. The substrate for suspension is characterized in that a dam comprising a second insulating layer is formed to cover the surrounding of an opening part of a wiring layer for via connection and in that the top part of the via plating part is as high as the top part of the above dam part or lower than it. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
