| 摘要 |
<p>The invention provides a mold which is used for manufacturing a carrier tape provided with a plurality of holes which are used for accommodating electronic components, arranged in a length direction and penetrate in a thickness direction, so that the flatness of lower surfaces, pasted with lower sealing tapes, of spaced portions among holes when electronic component tapes are formed can be ensured even if the space between holes is relatively narrow. The mold forms a recessed shape for end faces (67) of recessed portion dividing wall portions (66) among a plurality of hole formation recessed portions for accommodating hole formation projecting portions in a die (62). Further, the faces, facing the end faces (67), of the spaced portions (34) are curved or bent along the recessed shape due to compressive load when hole formation projecting portions are inserted into the hole formation recessed portions, but then the faces, pasted with the lower sealing tapes, of the space portions (34) among holes are recovered into a more flat state when the hole formation projecting portions are pulled out and the stress is released.</p> |
