| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which a void is hard to occur when a semiconductor chip is mounted on a wiring board, and a fillet is easy to be formed on a side surface of the semiconductor chip. <P>SOLUTION: The method of manufacturing a semiconductor device includes a first step in which a first resin part is formed inside a semiconductor chip mounting region of a wiring board which is equipped with the semiconductor chip mounting region, a second step in which a mask material is arranged on the wiring board, with an opening part through which the first resin part and its peripheral part are exposed being formed on the mask material, a third step in which a resin film is arranged on the mask material, including the opening part, and the resin film is, while being heated, pressurized to the wiring board side, to be integrated with the first resin part, and a fourth step in which the mask material is peeled while the resin film is being heated, a part of the resin film is left out at a position corresponding to the opening part on the wiring board, and a second resin part containing the first resin part and a part of the resin film is formed. During the fourth step, the second resin part is formed which has a protruding part higher than a peripheral edge at the central part. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
