| 发明名称 | Solder bump for ball grid array | ||
| 摘要 | A solder bump structure for a ball grid array (BGA) includes at least one under bump metal (UBM) layer and a solder bump formed over the at least one UBM layer. The solder bump has a bump width and a bump height and the ratio of the bump height over the bump width is less than 1. | ||
| 申请公布号 | US9159687(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201213572302 | 申请日期 | 2012.08.10 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chang Jung-Hua;Huang Cheng-Lin;Lin Jing-Cheng |
| 分类号 | H01L23/495;H01L23/00;H01L23/498 | 主分类号 | H01L23/495 |
| 代理机构 | Slater and Matsil, L.L.P. | 代理人 | Slater and Matsil, L.L.P. |
| 主权项 | 1. A method of forming a solder bump structure for a ball grid array (BGA), comprising: forming at least one under bump metal (UBM) layer over a substrate; forming a solder bump over the at least one UBM layer, wherein the solder bump has a bump width and a bump height and a ratio of the bump height over the bump width is less than 1; and forming at least one non-metallic core inside the solder bump, wherein forming the at least one non-metallic core comprises: placing the non-metallic core atop the solder bump; andreflowing the solder bump. | ||
| 地址 | Hsin-Chu TW | ||