NANO COPPER OXIDE INK COMPOSITION, SUBSTRATE USING THE SAME AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a nano-copper-oxide ink composition, a wiring substrate manufactured by using the same, and a method for producing the same. The purpose of the present invention is to form a wiring pattern without damage to a flexible wiring substrate such as a flexible printed circuit board. The present invention provides the nano-copper-oxide ink composition including nano-oxide-copper particles having copper oxide films, a reduction agent which forms nano-copper-particles by reducing oxidized copper by light irradiation, a dispersant, a binder, and a solvent. In addition the present invention provides a method for manufacturing a wiring substrate and a wiring substrate manufactured by the same. The method for manufacturing a wiring substrate includes: a screen printing step of forming a preliminary wiring pattern by performing screen printing on a flexible substrate body by using the nano-copper-oxide ink composition; a drying step of drying the screen-printed preliminary wiring pattern; and a light sintering step of reducing and sintering oxidized copper of the nano-copper-oxide particles included in the preliminary wiring pattern by irradiating the dried preliminary wiring pattern with light, and consequently forming a wiring pattern on the substrate body.