Process and composition for removing substances from substrates

摘要

Compositions are described that are useful for removing organic and organometallic substances from substrates, for example, photoresist wafers. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic or organometallic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties, and specifically negative dry film photoresist from electronic devices.

主权项

1. A composition comprising:
a) from about 20 wt. % to about 90 wt. % of a polar aprotic solvent other than dimethyl sulfoxide; b) from about 1 wt. % to about 70 wt. % of at least one alkanolamine having at least two carbon atoms, at least one amino substituent and at least one hydroxyl substituent, wherein the at least one amino substituent and the at least one hydroxyl substituent are attached to two different carbon atoms; c) less than about 3.5 wt. % of a quaternary ammonium hydroxide; d) optionally one or more secondary solvents, one or more corrosion inhibitors, and/or one or more surfactants; and e) water present in an amount no greater than about 1.5 wt. %.