Test system with temporary test structures

摘要

Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.

主权项

1. A test system for detecting manufacturing defects in conductive electronic device antenna structures under test, comprising:
temporary test structures that are brought into contact with the conductive electronic device antenna structures under test only during testing; a fixture that receives the conductive electronic device antenna structures under test and the temporary test structures, wherein the temporary test structures are configured to enhance the detection of manufacturing defects; and test probe structures configured to convey radio-frequency test signals to the conductive electronic device antenna structures under test and to receive corresponding test data from the conductive electronic device antenna structures under test while the radio-frequency test signals are being conveyed to the conductive electronic device antenna structures under test.