发明名称 Fin field-effect transistor (FinFET) device formed using a single spacer, double hardmask scheme
摘要 Approaches for providing a single spacer, double hardmask dual-epi FinFET are disclosed. Specifically, at least one approach for providing the FinFET includes: forming a set of spacers along each sidewall of a plurality of fins of the FinFET device; forming a first ultra-thin hardmask over the plurality of fins; implanting the first ultra-thin hardmask over a first set of fins from the plurality of fins; removing the first ultra-thin hardmask over a second set of fins from the plurality of fins untreated by the implant; forming an epitaxial (epi) layer over the second set of fins; forming a second ultra-thin hardmask over the FinFET device; implanting the second ultra-thin hardmask; removing the second ultra-thin hardmask over the first set of fins; and growing an epi layer over the first set of fins.
申请公布号 US9159630(B1) 申请公布日期 2015.10.13
申请号 US201414330063 申请日期 2014.07.14
申请人 GLOBALFOUNDRIES INC. 发明人 Wei Andy Chih-Hung;Yang Dae Geun;Choi Dae-han
分类号 H01L21/336;H01L29/76;H01L21/8238;H01L27/092 主分类号 H01L21/336
代理机构 Williams Morgan, P.C. 代理人 Williams Morgan, P.C.
主权项 1. A method for forming a fin field-effect transistor (FinFET) device, the method comprising: forming a set of spacers along each sidewall of a plurality of fins of the FinFET device; forming a first ultra-thin hardmask over the FinFET device; implanting the first ultra-thin hardmask over a first set of fins from the plurality of fins; removing the first ultra-thin hardmask over a second set of fins from the plurality of fins untreated by the implant; forming an epitaxial (epi) layer over the second set of fins; forming a second ultra-thin hardmask over the FinFET device; implanting the second ultra-thin hardmask; removing the second ultra-thin hardmask over the first set of fins; and growing an epi layer over the first set of fins.
地址 Grand Cayman KY