System and method for microelectronics lamination press

摘要

The system contains a lamination press. The first cavity is formed in a chassis. A film assembly is fitted within the chassis. A buffer mounts over the film assembly and within the chassis. A tool set is shaped to fit within the first cavity. The tool set and chassis are positioned within the lamination press to confer heat and pressure from the lamination press to the film assembly and chassis.

主权项

1. A method for laminating an electronic device having a first cavity, the method comprising the steps of:
tacking a conductive film to a substrate, forming a film assembly; positioning the film assembly within a chassis having the first cavity; at least partially filling the chassis with a buffer, wherein the buffer further comprises rubber pellets and the method further comprises the step of leveling out the plurality of rubber pellets; and applying a pressure and heat to the film assembly and the chassis.