Printed circuit board and method for manufacturing the same

摘要

Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.

主权项

1. A printed circuit board (PCB), comprising:
a base substrate comprising a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness, wherein the anchor structure has a neck portion and a head portion having larger surface area than the neck portion, and wherein a bismaleimide-triazine resin layer is formed on the black oxide layer in the needle structure, which is formed on the anchor structure, and wherein an interlayer adhesion between the metal pattern and the bismaleimide-triazine resin layer is more than 0.4 kgf/cm.