Laser assisted transfer welding process

摘要

A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

主权项

1. A method of printing transferable components, the method comprising:
providing a eutectic layer comprising a conductive material on a surface of a target substrate; pressing a stamp including at least one transferable semiconductor component thereon on the target substrate such that the at least one transferable component and the surface of the target substrate contact opposite surfaces of the eutectic layer, wherein the at least one transferable semiconductor component comprises a plurality of semiconductor dies, wherein respective ones thereof are on respective protruding post features of the stamp; during pressing of the stamp on the target substrate, exposing the at least one transferable component to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer; and then separating the stamp from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate.