| 发明名称 | Printed wiring board and method for manufacturing printed wiring board | ||
| 摘要 | A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads. Each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer. | ||
| 申请公布号 | US9161445(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201313930733 | 申请日期 | 2013.06.28 |
| 申请人 | IBIDEN CO., LTD. | 发明人 | Takada Masaru;Nagaya Fusaji;Okada Takao;Murata Tomohiko |
| 分类号 | H05K1/11;H01L21/48;H01L23/00;H05K3/24;H01L23/498;H01L25/065;H05K3/28;H05K3/34 | 主分类号 | H05K1/11 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A printed wiring board, comprising: a resin layer; a plurality of pads formed on the resin layer and positioned to be connected to an electronic component; and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads, wherein each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer, and the plurality of pads is positioned such that the electronic component is wire-bonded to the pads. | ||
| 地址 | Ogaki-shi JP | ||