Acoustic wave band reject filter

摘要

A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter circuit blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter circuit blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to electrodes of the dies.

主权项

1. An acoustic wave band reject filter, comprising:
a substrate, the substrate including bonding pads formed on the substrate; a plurality of dies, each die having a side facing the substrate and having electrodes; a plurality of acoustic wave band reject filter circuit blocks, at least one acoustic wave band reject filter circuit block being formed on a corresponding die and having at least one resonator, the electrodes being formed on the side of the corresponding die facing the substrate; a plurality of solder balls positioned between the substrate and the dies, to electrically connect bonding pads on the substrate and corresponding electrodes on the plurality of dies and to mechanically fix the dies to the substrate, at least one of the bonding pads on the substrate electrically connecting adjacent dies via the solder balls; and the plurality of acoustic wave band reject filter circuit blocks collectively exhibiting a band reject filter frequency response.