| 发明名称 | Semiconductor device and manufacturing method thereof | ||
| 摘要 | A semiconductor device includes a die, a conductive post disposed adjacent to the die, and a molding surrounding the conductive post and the die, the molding includes a protruded portion protruded from a sidewall of the conductive post and disposed on a top surface of the conductive post. Further, a method of manufacturing a semiconductor device includes disposing a die, disposing a conductive post adjacent to the die, disposing a molding over the conductive post and the die, removing some portions of the molding from a top of the molding, and forming a recess of the molding above a top surface of the conductive post. | ||
| 申请公布号 | US9159678(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201314082977 | 申请日期 | 2013.11.18 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. | 发明人 | Cheng Li-Hui;Tsai Po-Hao;Hung Jui-Pin |
| 分类号 | H01L23/52;H01L23/00;H01L21/56;H01L23/31;H01L23/482 | 主分类号 | H01L23/52 |
| 代理机构 | WPAT, P.C. | 代理人 | WPAT, P.C. ;King Anthony |
| 主权项 | 1. A semiconductor device, comprising: a die; a conductive post disposed adjacent to the die; and a molding surrounding the conductive post and the die, wherein the molding includes a protruded portion protruded from a sidewall of the conductive post, disposed on a top surface of the conductive post, and surrounding a portion of a redistribution layer (RDL) electrically coupled with the conductive post. | ||
| 地址 | Hsinchu TW | ||