| 发明名称 | Packaging substrate and method for manufacturing same | ||
| 摘要 | A packaging substrate includes a first wiring layer, a first dielectric layer formed on the first wiring layer, a second wiring layer formed on the first dielectric layer, and a number of copper pillar bumps. Each copper pillar bump includes a base portion and a protruding portion. The base portion is connected to the first wiring layer, and the protruding portion is formed on the base portion. A size of the protruding portion is less than a size of the base portion, and a size of the copper pillar bump gradually increases from the protruding portion to the base portion. | ||
| 申请公布号 | US9159614(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201314140461 | 申请日期 | 2013.12.24 |
| 申请人 | Zhen Ding Technology Co., Ltd. | 发明人 | Su Wei-Shuo |
| 分类号 | H01L23/12;H01L21/768;H01L23/498;H01L21/48;H01L21/683 | 主分类号 | H01L23/12 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A packaging substrate, comprising: a first wiring layer; a first dielectric layer formed on the first wiring layer; a second wiring layer formed on the first dielectric layer; a plurality of copper pillar bumps, each copper pillar bump comprising a base portion and a protruding portion; the base portion connected to the first wiring layer and portions of the first wiring layer exposed from the base portion, the protruding portion formed on the base portion; and a first conductive layer formed on surfaces of the first wiring layer exposed from the base portion, and formed on surfaces of the base portion away from the first wiring layer, and formed on side surfaces of the base portion; wherein a size of the protruding portion is less than a size of the base portion, and a size of the copper pillar bumps gradually increases from the protruding portion to the base portion. | ||
| 地址 | Tayuan, Taoyuan TW | ||