发明名称 Piezoelectric device and electronic apparatus
摘要 A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.
申请公布号 US9160254(B2) 申请公布日期 2015.10.13
申请号 US201414153388 申请日期 2014.01.13
申请人 Seiko Epson Corporation 发明人 Horie Kyo
分类号 H03L1/04;H03B5/32;H03B1/02;H02N2/00;H03L1/02 主分类号 H03L1/04
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A piezoelectric device comprising: an insulating substrate including: a first concavity bordered by a first wall; anda second concavity bordered by a second wall, the second concavity opening in an opposite direction as the first concavity; an element mounting pad mounted to the insulating substrate in the first concavity; a piezoelectric vibration element mounted to the element mounting pad; a temperature sensor mounting pad mounted to the insulating substrate in the second concavity; a temperature sensor mounted to the temperature sensor mounting pad; a metal sealing body secured to the first wall; a metal lid secured to the metal sealing body, the metal lid enclosing the first concavity; a metal heat transfer member reaching to the metal sealing body from the temperature sensor mounting pad by way of the first wall so as to thermally connect the temperature sensor and the metal lid.
地址 JP