发明名称 |
Method of fabricating of circuit board |
摘要 |
A method of fabricating a circuit board is provided. An elastic bump material layer is formed on a substrate and then is patterned to form a plurality of first elastic bumps and a plurality of second elastic bumps, arranged in at least an array. A conductive layer is formed and then is patterned to form a patterned circuit layer to cover first plurality of elastic bumps and a portion of the substrate. An entirety of the plurality of second elastic bumps and another portion of the substrate are not covered by the patterned circuit layer. A protection layer is formed to cover a portion of the patterned circuit layer, a second number of the plurality of second elastic bumps entirely, a third number of the plurality of second elastic bumps partially and the another portion of the substrate, and expose the first number of the plurality of second elastic bumps. |
申请公布号 |
US9161455(B2) |
申请公布日期 |
2015.10.13 |
申请号 |
US201313896351 |
申请日期 |
2013.05.17 |
申请人 |
Taiwan TFT LCD Association;Chunghwa Picture Tubes, LTD.;Au Optronics Corporation;Hannstar Display Corporation;Innolux Corporation;Industrial Technology Research Institute |
发明人 |
Tsang Ngai;Kao Kuo-Shu |
分类号 |
H05K3/02;H05K3/10;H05K1/02;H05K1/11;H05K3/38;H05K3/06 |
主分类号 |
H05K3/02 |
代理机构 |
Jianq Chyun IP Office |
代理人 |
Jianq Chyun IP Office |
主权项 |
1. A method of fabricating a circuit board, comprising:
forming a elastic bump material layer on a substrate; patterning the elastic bump material layer to form a plurality of first elastic bumps and a plurality of second elastic bumps, arranged in at least an array, wherein a first number of the plurality of second elastic bumps is not adjacent to the plurality of first elastic bumps; forming at least a conductive layer, covering the plurality of first and second elastic bumps and the substrate; patterning the conductive layer to form a patterned circuit layer covering the first plurality of elastic bumps and a portion of the substrate, wherein an entirety of the plurality of second elastic bumps and another portion of the substrate are not covered by the patterned circuit layer; and forming a protection layer, wherein the protection layer covers a portion of the patterned circuit layer, a second number of the plurality of second elastic bumps entirely, a third number of the plurality of second elastic bumps partially and the another portion of the substrate, and exposes the first number of the plurality of second elastic bumps. |
地址 |
Hsinchu TW |