Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof

摘要

An article comprises a solvent cast film comprising a polyetherimide comprising structural units derived from a dianhydride component selected from the group consisting of 3,4′-oxydiphthalic anhydride, 3,3′-oxydiphthalic anhydride, 4,4′-oxydiphthalic anhydride, and combinations thereof, and a diamine component. The polyetherimide has a glass transition temperature that is at least 190° C. The film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight. The film has less than 15 molar % of a member selected from the group consisting of biphenyltetracarboxylic acid, dianhydrides of biphenyltetracarboxylic acid, esters of biphenyltetracarboxylic acid, and combinations thereof.

主权项

1. An article comprising a solvent cast film, the film comprising
a thermoplastic polyimide consisting essentially of structural units derived from polymerization of
a dianhydride component comprising at least 80 mole % of a dianhydride selected from the group consisting of 3,4′-oxydiphthalic anhydride, 3,3′-oxydiphthalic anhydride, 4,4′-oxydiphthalic anhydride, and combinations thereof, based on the total moles of dianhydride witha diamine component consisting of at least 80 mole % p-phenylenediamine based on the total moles of the diamine component and up to 20 mole % of a diamine selected from the group consisting of 4,4′-diaminodiphenyl sulfone, m-phenylenediamine, and combinations thereof; wherein the dianhydride component and the diamine component are in a molar ratio of from 1 to 1.3 moles diamine per mole of dianhydride;wherein the polyimide has a glass transition temperature of 190° C. or greater;wherein the film has
a coefficient of thermal expansion of less than 30 ppm/° C. measured over 30° C. to 200° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight;wherein the polyimide has less than 15 molar % of structural units derived from a member of the group consisting of biphenyltetracarboxylic acid, a dianhydride of biphenyltetracarboxylic acid, an ester of biphenyltetracarboxylic acid, and a combination thereof; and
wherein the film further comprises an exfoliated nanoclay and has a lower CTE (measured over 30° C. to 200° C.) than a film of the same composition without the exfoliated nanoclay.