Wafer level phosphor coating method and devices fabricated utilizing method

摘要

Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

主权项

1. A light emitting diode (LED) chip, comprising:
an LED comprising a textured surface, said LED comprising semiconductor layers; a contact on said semiconductor layers; a pedestal in electrical contact with and formed on said contact; and a coating at least partially covering said LED, said coating comprising a light emitting surface, said pedestal extending through to the light emitting surface of said coating and exposed at the surface of said coating for electrical contact, wherein said coating is conformal such that said coating comprises a substantially uniform thickness over said textured surface.