发明名称 |
Method of forming a germanium-containing FinFET |
摘要 |
A method includes forming isolation regions in a semiconductor substrate, forming a first semiconductor strip between opposite portions of isolation regions, forming a second semiconductor strip overlying and contacting the first semiconductor strip, and performing a first recessing to recess the isolation regions. A portion of the second semiconductor strip over top surfaces of remaining portions of the isolation regions forms a semiconductor fin. A second recessing is performed to recess the isolation regions to extend the semiconductor fin downwardly, with an inter-diffusion region of the first semiconductor strip and the second semiconductor strip being exposed after the second recessing. The inter-diffusion region is then etched. |
申请公布号 |
US9159552(B2) |
申请公布日期 |
2015.10.13 |
申请号 |
US201314142435 |
申请日期 |
2013.12.27 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Fan Chun-Hsiang;Lu Kun-Yen;Huang Yu-Lien;Tsai Ming-Huan |
分类号 |
H01L21/76;H01L21/02;H01L29/417;H01L29/66;H01L21/762 |
主分类号 |
H01L21/76 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method comprising:
forming isolation regions in a semiconductor substrate; forming a first semiconductor strip between opposite portions of isolation regions; forming a second semiconductor strip overlying and contacting the first semiconductor strip; performing a first recessing to recess the isolation regions, wherein a portion of the second semiconductor strip over top surfaces of remaining portions of the isolation regions forms a semiconductor fin; performing a second recessing to recess the isolation regions to extend the semiconductor fin downwardly, with an inter-diffusion region of the first semiconductor strip and the second semiconductor strip being exposed after the second recessing; and etching the inter-diffusion region. |
地址 |
Hsin-Chu TW |