Wafer-level packaged device having self-assembled resilient leads

摘要

A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.

主权项

1. A process comprising:
forming resilient leads on a wafer configured to be segmented into integrated circuit chips; applying a guard to the wafer, the guard configured to protect the resilient leads; and segmenting the wafer to separate an integrated circuit chip from the wafer, the integrated circuit chip including at least one resilient lead, wherein the at least one resilient lead is configured to move from a first position to a second position during an assembly reflow process, the resilient lead being held adjacent to the integrated circuit chip in the first position and extending away from the integrated circuit chip in the second position to provide electrical interconnection of the integrated circuit chip to a printed circuit board.