发明名称 Semiconductor device
摘要 Disclosed is a semiconductor device. For instance, the semiconductor device includes a main via formed on a dielectric and a ground via formed in a circular arc shape and spaced apart from the main via. The semiconductor device is superior in electric characteristics such as insertion loss or reflection loss and allows efficient use of space.
申请公布号 US9159625(B1) 申请公布日期 2015.10.13
申请号 US201113015445 申请日期 2011.01.27
申请人 Amkor Technology, Inc. 发明人 Lee Seung Jae;Kim Sang Won;Bae Ki Cheol;Yu Ji Heon
分类号 H01L23/48;H01L21/78 主分类号 H01L23/48
代理机构 McAndrews, Held & Malloy 代理人 McAndrews, Held & Malloy
主权项 1. A semiconductor device, comprising: a dielectric; a main via formed through the dielectric; and a ground via comprising two circular arc segments extending through the dielectric and spaced apart from the main via, wherein a radian angle characterizing each of the two circular arc segments of the ground via is about π/4, and a reflection loss ranges from about −10 dB to about −30 dB for signals at all frequencies between 0 GHz and 80 GHz input to the main via.
地址 Tempe AZ US