Semiconductor module with a semiconductor chip and a passive component and method for producing the same

摘要

A semiconductor module includes a semiconductor chip and a passive discrete component. The semiconductor chip includes on its top side and/or on the back side one or more contacts, which in its two-dimensional extent takes up the top side and/or the back side of the semiconductor chip virtually completely. The passive component, arranged in a package, is stacked on one of the contacts. The electrode of the passive component is electrically connected with one of the contacts. The counter electrode of the passive component is operatively connected with a control or signal electrode of the semiconductor chip or an electrode of a further semiconductor chip.

主权项

1. A semiconductor module comprising:
a semiconductor chip including:
a control electrode disposed on a portion of an external face of the semiconductor chip, anda contact having a two-dimensional extent that substantially covers a remaining portion of the external face; and a passive discrete component arranged in a package and stacked on the contact, the passive discrete component comprising:
an electrode having a side facing the semiconductor chip and attached to the contact of the semiconductor chip such that the electrode is electrically connected to and fixed on the contact, anda counter electrode having a side facing the semiconductor chip and attached to the control electrode of the semiconductor chip such that counter electrode is electrically connected to and fixed on the control electrode.