Bonded structure with enhanced adhesion strength

摘要

A first bonding material layer is formed on a first substrate and a second bonding material layer is formed on a second substrate. The first and second bonding material layers include a metal. Ions are implanted into the first and second bonding material layers to induce structural damages in the in the first and second bonding material layers. The first and second substrates are bonded by forming a physical contact between the first and second bonding material layers. The structural damages in the first and second bonding material layers enhance diffusion of materials across the interface between the first and second bonding material layers to form a bonded material layer in which metal grains are present across the bonding interface, thereby providing a high adhesion strength across the first and second substrates.

主权项

1. A bonded structure comprising a vertical stack, from bottom to top, of a first substrate, a structurally damaged bonded material layer of a first structurally damaged metallic material layer and a second metallic material layer, and a second substrate, wherein said structurally damaged bonded material layer includes metal grains extending across an interface between said first structurally damaged metallic material layer and said second metallic material layer, wherein said first structurally damaged metallic material layer includes a first metallic composition comprising an ionic species and an elemental metal, and said second metallic material layer includes a second metallic composition comprising an elemental metal, wherein said first metallic composition is different from said second metallic composition.