Soldering apparatus and manufacturing method of soldered product

摘要

An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece.

主权项

1. A soldering apparatus, comprising:
a thermal radiation heater configured to heat a workpiece to be soldered by thermal radiation; and two coolers configured to cool by thermal conduction the workpiece soldered, the coolers being arranged to sandwich the thermal radiation heater therebetween, movable between a standby position and a cooling position, and formed with a recessed portion, the recessed portion configured to dispose therein the thermal radiation heater sandwiched between the two coolers; wherein the coolers are configured to be moved to the standby position where the coolers are separated from the workpiece and stand by such that the thermal radiation heater is in a state of protruding from the recessed portion, the state of protruding being due to the moving, while the thermal radiation heater heats the workpiece, and the coolers are configured to be moved from the standby position to the cooling position to cool the workpiece in which the coolers are in contact with the workpiece.