| 发明名称 | Wiring board and probe card using the same | ||
| 摘要 | A wiring board 3 according to the present invention includes a first resin layer 18a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18a; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18a. | ||
| 申请公布号 | US9157932(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201213728877 | 申请日期 | 2012.12.27 |
| 申请人 | KYOCERA Circuit Solutions, Inc. | 发明人 | Taguchi Takayuki;Terada Kenji |
| 分类号 | G01R1/073;H05K1/03;H05K1/02;H05K3/00;H05K3/46;G01R3/00 | 主分类号 | G01R1/073 |
| 代理机构 | Procopio, Cory, Hargreaves & Savitch LLP | 代理人 | Procopio, Cory, Hargreaves & Savitch LLP |
| 主权项 | 1. A wiring board comprising: a first resin layer formed of a thermoplastic resin; a conductive layer formed partially on the first resin layer; a through hole for insertion of a screw formed in a region where the conductive layer is not formed and penetrating through the first resin layer in a thickness direction thereof; and a dummy via hole for alleviating a transmission of an entangling stress formed in a region between the through hole and the conductive layer and penetrating through the first resin layer. | ||
| 地址 | Kyoto JP | ||