| 发明名称 | Lead free solder bumps | ||
| 摘要 | Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability. | ||
| 申请公布号 | US9156111(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201414558089 | 申请日期 | 2014.12.02 |
| 申请人 | MK ELECTRON CO., LTD.;HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION;KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY;KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY;KOREA ELECTRONICS TECHNOLOGY INSTITUTE | 发明人 | Hong Sung Jae;Kim Keun Soo;Lee Chang Woo;Bang Jung Hwan;Ko Yong Ho;Lee Hyuck Mo;Chang Jae Won;Koo Ja Hyun;Moon Jeong Tak;Lee Young Woo;Hong Won Sik;Kim Hui Joong;Lee Jae Hong |
| 分类号 | H01L23/48;H01L21/44;B23K31/00;B23K35/26;B23K35/02;H01L23/00;B23K1/00 | 主分类号 | H01L23/48 |
| 代理机构 | Volpe and Koenig, P.C. | 代理人 | Volpe and Koenig, P.C. |
| 主权项 | 1. A primarily tin (Sn), lead-free solder comprising: Cu in a range from about 0.1 wt % to about 0.8 wt %; Pd in a range from about 0.001 wt % to about 0.1 wt %; Al in a range from about 0.001 wt % to about 0.1 wt %; Si in a range from about 0.001 wt % to about 0.1 wt %; and Sn and inevitable impurities as remainders. | ||
| 地址 | KR | ||