| 发明名称 | Wiring board and method of manufacturing the same | ||
| 摘要 | A wiring board includes a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion inwardly protruding relative to the first and second opening portions, and wherein the electronic part is held by the inward protruding portion. | ||
| 申请公布号 | US9161453(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201313914894 | 申请日期 | 2013.06.11 |
| 申请人 | SHINKO ELECTRIC INDUSTRIES CO., LTD. | 发明人 | Koyanagi Takaaki |
| 分类号 | H05K1/18;H05K3/30;H05K3/00;H05K3/46 | 主分类号 | H05K1/18 |
| 代理机构 | IPUSA, PLLC | 代理人 | IPUSA, PLLC |
| 主权项 | 1. A wiring board comprising: a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer,a second opening portion provided on a second surface of the core layer, andan inward protruding portion inwardly protruding relative to the first and second opening portions, wherein the electronic part is held by the inward protruding portion, wherein an insulating layer and a wiring layer are sequentially laminated on the first surface of the core layer, wherein the wiring layer includes a wiring pattern formed on a first surface of the insulating layer, and wherein the wiring layer includes via wiring which is formed inside the insulating layer and electrically connected to an electrode of the electronic part. | ||
| 地址 | Nagano JP | ||