| 发明名称 | Thermoacoustic chip | ||
| 摘要 | A thermoacoustic chip includes a substrate, a sound wave generator, a first electrode, and a second electrode, and an integrated circuit chip. The substrate has a first surface. The sound wave generator is located on the first surface of the substrate. The first electrode and a second electrode are spaced from each other and electrically connected to the sound wave generator. The integrated circuit chip is located on the substrate and electrically connected to the first electrode and the second electrode. | ||
| 申请公布号 | US9161135(B2) | 申请公布日期 | 2015.10.13 |
| 申请号 | US201313930510 | 申请日期 | 2013.06.28 |
| 申请人 | Tsinghua University;HON HAI PRECISION INDUSTRY CO., LTD. | 发明人 | Wei Yang;Fan Shou-Shan |
| 分类号 | H04R25/00;H04R23/00;B82Y30/00 | 主分类号 | H04R25/00 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A thermoacoustic chip comprising: a substrate having a first surface and a second surface opposite to the first surface; a sound wave generator located on the first surface of the substrate; a first electrode and a second electrode; an insulating layer located on the first surface of the substrate and sandwiched between the substrate and the sound wave generator so that the first electrode, the second electrode, and the sound wave generator are insulated from the substrate by the insulating layer; and an integrated circuit chip located on the substrate and electrically connected to the first electrode and the second electrode, wherein the first electrode and the second electrode are spaced from each other and electrically connected to the sound wave generator; wherein the substrate defines a recess on one of the first surface and the second surface, and the integrated circuit chip is located in the recess and not fully enclosed by the substrate. | ||
| 地址 | Beijing CN | ||