发明名称 Method for making an electrical inductor and related inductor devices
摘要 A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
申请公布号 US9159485(B2) 申请公布日期 2015.10.13
申请号 US201313972286 申请日期 2013.08.21
申请人 HARRIS CORPORATION 发明人 Weatherspoon Michael Raymond;Rendek, Jr. Louis Joseph;Shacklette Lawrence Wayne;Maloney Robert Patrick;Smith David M.
分类号 H01F5/00;H01F27/28;H01F17/00;H01F41/04;H05K1/16;H05K3/20;H05K3/14;H05K3/16 主分类号 H01F5/00
代理机构 Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. 代理人 Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
主权项 1. An electrical inductor comprising: a dielectric layer comprising a liquid crystal polymer (LOP); a first electrically conductive layer of a first metal and on said dielectric layer, said first electrically conductive layer comprising at least one column extending vertically through said dielectric layer and defining terminals; a second electrically conductive layer over said dielectric layer comprising the first metal and defining inductive turns, the first metal comprising copper; and a Cu3Sn intermetallic compound of the first metal and a second metal bonding adjacent metal portions together of said at least one column of said first electrically conductive layer and portions of said second electrically conductive layer over said at least one column, the second metal comprising tin; portions of said second electrically conductive layer not over said at least one column of said first electrically conductive layer being spaced apart from said dielectric layer; the first metal having a melting point temperature greater than that of the second metal; the second metal having a melting point temperature below a lamination temperature of the dielectric layer.
地址 Melbourne FL US