发明名称 INKJET MARKING EQUIPMENT AND METHOD OF PERFORMING AN INKJET MARKING ON A SEMICONDUCTOR PACKAGE USING THE SAME
摘要 Inkjet marking equipment is disclosed. The marking equipment includes a loader part which supplies a semiconductor package to be marked, a plasma cleaning part which cleans the surface of the semiconductor package supplied from the loader by using a plasma process, an inkjet marking part which injects ink to the surface of the semiconductor package cleaned by the plasma cleaning part and prints an identification mark, an unloader part which accommodates the semiconductor package with the identification mark and discharges it, and a transfer part which includes a transfer rail which is connected to the plasma cleaning part and is extended to connect the inkjet making part and the unloader part, and a stage which is fixed to the transfer rail, moves along the transfer rail, and is to mount the semiconductor package. The adhesion between the ink and the semiconductor package is improved. The printing error of the ink is prevented.
申请公布号 KR20150114229(A) 申请公布日期 2015.10.12
申请号 KR20140038553 申请日期 2014.04.01
申请人 发明人
分类号 H01L23/544;H01L21/302;H01L21/677;H01L21/683 主分类号 H01L23/544
代理机构 代理人
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