发明名称 LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD
摘要 The present invention relates to a light emitting device package used for display or lighting, a backlight unit, a lighting device and its manufacturing method. The light emitting device package may include: a substrate core layer made of a thermal conductivity material; a substrate insulating layer which surrounds the substrate core layer and is made of an insulating mixture where binder and heat radiating powder are mixed; an upper electrode layer which is formed on the upper side of the substrate insulating layer and comprises a first electrode layer and a second insulating layer with an electrode separation space; a lower electrode layer formed on the lower side of the substrate insulating layer; and a lateral electrode layer which is formed on the lateral side of the substrate insulating layer and electrically connects the upper electrode layer and the lower electrode.
申请公布号 KR20150114226(A) 申请公布日期 2015.10.12
申请号 KR20140038549 申请日期 2014.04.01
申请人 LUMENS CO., LTD.;WAVENICS, INC. 发明人 KIM, KYOUNG MIN;CHO, YONG WOOK;GONG, MYEONG KOOK;YOO, SUNG HWAN
分类号 H01L33/62;H01L33/36 主分类号 H01L33/62
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