发明名称 |
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
The present invention relates to a light emitting device package used for display or lighting, a backlight unit, a lighting device and its manufacturing method. The light emitting device package may include: a substrate core layer made of a thermal conductivity material; a substrate insulating layer which surrounds the substrate core layer and is made of an insulating mixture where binder and heat radiating powder are mixed; an upper electrode layer which is formed on the upper side of the substrate insulating layer and comprises a first electrode layer and a second insulating layer with an electrode separation space; a lower electrode layer formed on the lower side of the substrate insulating layer; and a lateral electrode layer which is formed on the lateral side of the substrate insulating layer and electrically connects the upper electrode layer and the lower electrode. |
申请公布号 |
KR20150114226(A) |
申请公布日期 |
2015.10.12 |
申请号 |
KR20140038549 |
申请日期 |
2014.04.01 |
申请人 |
LUMENS CO., LTD.;WAVENICS, INC. |
发明人 |
KIM, KYOUNG MIN;CHO, YONG WOOK;GONG, MYEONG KOOK;YOO, SUNG HWAN |
分类号 |
H01L33/62;H01L33/36 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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