POLISHING METHOD AND HOLDER

摘要

The polishing method of the present invention comprises a polishing process to pressurize a surface to be polished of an object to be polished supported by a holder; to let it contact a polishing pad; to supply a composition for polishing on the polishing pad; to have the holder and the polishing pad make a relative rotation; and to polish the surface to be polished of the object to be polished. During the polishing process, the object to be polished supported by the holder rotates by maintaining the surface of the object to be polished facing the polishing pad and changes the direction of the object to be polished.