| 摘要 |
The present invention relates to a heat radiation device of an electronic component, which includes a heat radiation unit which discharges heat in contact with the electronic component and an elastic support unit which is installed in the heat radiation unit to elastically support the electronic component by closely attaching the electronic component on the inner side of the heat radiation part. Therefore, the present invention improves heat radiation performance by increasing the adhesion and a contact area between the heat radiation unit and the electronic component and easily attaches the heat radiation unit to or detaches the same from the electronic component by closely fixing the heat radiation unit on the outer side of the electronic component by the elastic support unit. |
