| 摘要 |
(Subject) Provided is a semiconductor wafer for easily identifying different kinds of semiconductor chips of the same chip size wherein many kinds of semiconductor chips are attached onto a surface of the semiconductor wafer. (Solution) An exceptional area(7) is formed on an outer circumference of the semiconductor wafer. The inside of the semiconductor wafer is divided into A, B, C, and D which have different kinds. A, B, C, and D, semiconductor chip areas, are divided by boundaries(22, 23, 24). Mark chips(1, 2, 3, 4) are arranged around both ends of boundaries(21, 22, 23, 24). |
